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To meet 'tremendous and humongous demand' from AI customers, SK Hynix accelerates 2027 fab plans by three months, with an even fresher fab beginning wafer production next month

We already knew SK Hynix had multiple new memory chip fabs in the works, but completion of any of them was still too far off to know if they’d have any tangible effect on the raging memory supply crisis. Well, the major memory maker has just announced its intentions to accelerate construction plans for one fab by three months, now aiming to finish up in February 2027. Furthermore, an already-existing fab is expected to start churning out wafers as soon as next month.

This follows news earlier this week that the South Korean memory manufacturer planned to invest a further 19 trillion won (or $12.90 billion) into another advanced chip packaging facility in Cheongju. The company announced in December that it planned “to invest approximately 30% of our sales in facilities in 2026 and accelerate the transition to 1c DRAM, but it will be difficult to resolve the supply shortage.”

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